Enterprise-owned data center
Enterprise-owned data center
Server Cold-Plate Assembly
The server cold plate assembly adopts mature micro-channel liquid cooling technology. It achieves chip-level efficient heat dissipation by optimizing the flow channel design, significantly improving the heat dissipation efficiency. The assembly supports a heat flux density of 75+W/cm², and the helium mass spectrometry leak rate is ≤1×10⁻³ mbar·L/s (meeting the ISO 19938 Class B standard), and it can be adapted to mainstream platforms such as Nvidia, Intel, and AMD.
Heat flux density＞75W/cm²
Professional cold-plate design
Leakage rate1.0E-5Pa.m³/s
Professional testing equipment
Value proposition
Accurate simulationBased on mainstream simulation software, the adaptability verification of the server structure, flow rate optimization, and thermal performance prediction are realized.
Output a design solution with a flow unevenness of ≤ 8%.
Control the temperature difference error between simulation and actual measurement within ± 3℃.
Efficient heat dissipationSupports a heat flux density of 75+W/cm²
Meets the cooling requirements of 1000W+ GPUs at a pressure drop of 5kPa
Chip temperature ≤85℃ under full-load operating conditions
Safe and reliablePassed the 85psi pressure tightness test (ISO 19938 Class B)
Helium mass spectrometry leak rate ≤ 1×10⁻³ mbar·L/s
Coolant conductivity ≤ 5μS/cm
Application scenarios
Event
